To verify this statement, we must understand the concept of CPO (co-packaging of optoelectronics) .
CPO is an optoelectronic packaging solution that is optimized in terms of cost, power consumption, and integration.
The capital market is already familiar with optical modules. Since ChatGPT set off a wave of global AI investment, data center infrastructure investment has continued to drive the demand for optical modules every year.
According to Light counting's forecast, the global optical module market size will maintain a CAGR of 12% in the next five years, and will exceed US$20 billion in 2027, with data centers becoming the largest application market.
In the technological evolution route within high-speed optical modules, CPO emerged as the optimal solution to achieve higher integration, lower power consumption and cost.
The rapid development of current high-computing power india car owner data application scenarios will accelerate the evolution of optical modules from 400G/800G to 1.6T. At the 1.6T rate, the integration and power consumption of traditional pluggable optical modules will become more prominent.
CPO is expected to replace traditional pluggable optical modules because it heterogeneously integrates the optical transceiver module and the ASIC chip for control calculation in one package, improving the interconnection density between the two while achieving lower power consumption.
Silicon photonics technology, one of the core technologies of CPO, is the mainstream solution for achieving highly integrated chips . It uses silicon and silicon-based substrate materials as optical media and manufactures corresponding photonic and optoelectronic devices through integrated circuit processes. Based on the inherent characteristics of silicon materials, silicon photonic modules have significant advantages in high integration, high speed and low cost compared to traditional optical modules.
Judging from the pace of industrial development, the silicon photonics industry chain is being improved and has initially covered various links including technology research institutions, design tool providers, system equipment vendors, foundries, and users.
CPO, another tenfold increase in ten years?
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