Breakthrough of Chinese chipmakers
Powev Electronic Technology Co., a Shenzhen-based storage and memory manufacturer, recently took the wraps off its latest high-end SSD under its subsidiary brand Asgard, which is based on YMTC's 128-layer 3D triple-level cell (TLC) NAND flash memory. According to industry insiders, "The announcement means that YMTC's 128-layer technology has officially been mass-produced," Chinese news site guancha reported.
The Wuhan-based 3D NAND flash memory maker was only established in July 2016. In April 2020, it announced that its 128-layer technology had passed sample verification on an SSD platform, less than a year after its 64-layer TLC 3D NAND flash memory was produced in volume.
Higher density will allow for increased storage capacity. With its 128-layer line, YMTC closes the gap with South Korean memory giants SK Hynix and Samsung, among other notable chipmakers.
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SK Hynix announced in June 2019 that it had begun mass production of the world's first 128-layer 4D NAND.
In a radical breakthrough, Micron, a smaller rival of the uk telegram number database two South Korean conglomerates, announced in November 2020 that it had begun volume shipments of the world's first 176-layer 3D NAND flash memory, which boasts an industry-first density.
However, YMTC's remarkable progress over the past five years has not been enough to give it a boost in the global memory rankings, industry data showed.
In the first quarter of this year, Samsung ranked first in revenue in the global NAND flash memory market with a 33.5 percent share of the global market, according to data from marketing analytics provider TrendForce.
Japanese memory maker Kioxia is second with 18.7% of the market, followed by American Western Digital with 14.7%, SK Hynix with 12.3%, Micron with 11.1% and Intel with 7.5%.
The news that the 128-layer memory chip from Chinese chip manufacturer YMTC has been launched into mass production was prepared by the PRC.TODAY Portal based on materials from the Global Times news agency.